Thermal properties and corrosion resistance of organoclay/epoxy resin film

M. Baiquni, Bambang Soegijono

Research output: Contribution to journalConference articlepeer-review

Abstract

Hybrid materials organoclay/epoxy resin films were prepared by varying organoclay content in epoxy resin as a matrix. The film were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FT-IR), scanning electron microscopy (SEM), and thermal conductivity. TGA and FT-IR results confirmed that the melting temperature shifted to a lower point. The thermal conductivity and corrosion resistant generally increase with increasing organoclay content. The changes on these properties may due to cross link between organoclay and epoxy.

Original languageEnglish
Article number012037
JournalJournal of Physics: Conference Series
Volume985
Issue number1
DOIs
Publication statusPublished - 19 Mar 2018
Event3rd International Symposium on Frontier of Applied Physics, ISFAP 2017 - Jakarta, Indonesia
Duration: 23 Oct 201724 Oct 2017

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