TY - JOUR
T1 - Thermal properties and corrosion resistance of organoclay/epoxy resin film
AU - Baiquni, M.
AU - Soegijono, B.
N1 - Publisher Copyright:
© Published under licence by IOP Publishing Ltd.
PY - 2018/3/19
Y1 - 2018/3/19
N2 - Hybrid materials organoclay/epoxy resin films were prepared by varying organoclay content in epoxy resin as a matrix. The film were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FT-IR), scanning electron microscopy (SEM), and thermal conductivity. TGA and FT-IR results confirmed that the melting temperature shifted to a lower point. The thermal conductivity and corrosion resistant generally increase with increasing organoclay content. The changes on these properties may due to cross link between organoclay and epoxy.
AB - Hybrid materials organoclay/epoxy resin films were prepared by varying organoclay content in epoxy resin as a matrix. The film were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FT-IR), scanning electron microscopy (SEM), and thermal conductivity. TGA and FT-IR results confirmed that the melting temperature shifted to a lower point. The thermal conductivity and corrosion resistant generally increase with increasing organoclay content. The changes on these properties may due to cross link between organoclay and epoxy.
UR - http://www.scopus.com/inward/record.url?scp=85045677012&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/985/1/012037
DO - 10.1088/1742-6596/985/1/012037
M3 - Conference article
AN - SCOPUS:85045677012
SN - 1742-6588
VL - 985
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 012037
T2 - 3rd International Symposium on Frontier of Applied Physics, ISFAP 2017
Y2 - 23 October 2017 through 24 October 2017
ER -