Hybrid materials organoclay/epoxy resin films were prepared by varying organoclay content in epoxy resin as a matrix. The film were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared spectroscopy (FT-IR), scanning electron microscopy (SEM), and thermal conductivity. TGA and FT-IR results confirmed that the melting temperature shifted to a lower point. The thermal conductivity and corrosion resistant generally increase with increasing organoclay content. The changes on these properties may due to cross link between organoclay and epoxy.
|Journal||Journal of Physics: Conference Series|
|Publication status||Published - 19 Mar 2018|
|Event||3rd International Symposium on Frontier of Applied Physics, ISFAP 2017 - Jakarta, Indonesia|
Duration: 23 Oct 2017 → 24 Oct 2017