TY - JOUR
T1 - The effect of saccharin addition to nickel electroplating on the formation of nanocrystalline nickel deposits
AU - Riastuti, R.
AU - Siallagan, S. T.
AU - Rifki, A.
AU - Herdino, F.
AU - Ramadini, C.
N1 - Publisher Copyright:
© Published under licence by IOP Publishing Ltd.
PY - 2019/7/3
Y1 - 2019/7/3
N2 - This study investigates the effect of saccharin addition on nickel deposits. Coating substrates with nickel is carried out through electroplating. This method involves Watts bath, 0, 1, 3, and 5 g/L saccharin, and a current density of 6 A/dm2. The electroplating process lasts for 20 minutes at 50°C. The plated substrate is a Steel Plate Cold Rolled Coil (SPCC). The deposits attached to the SPCC surface is characterized by a Scanning Electron Microscope (SEM) to observe the structural changes of the deposits and an X-Ray Diffraction (XRD) to calculate their grain size. The results show that, first, nickel deposits without saccharin addition has a pyramidal and crystal polyhedral structure while those with saccharin reflect a globular structure and colonial patterns. Secondly, the addition of 5g/L saccharin produces the smallest grain, 17.39 nm.
AB - This study investigates the effect of saccharin addition on nickel deposits. Coating substrates with nickel is carried out through electroplating. This method involves Watts bath, 0, 1, 3, and 5 g/L saccharin, and a current density of 6 A/dm2. The electroplating process lasts for 20 minutes at 50°C. The plated substrate is a Steel Plate Cold Rolled Coil (SPCC). The deposits attached to the SPCC surface is characterized by a Scanning Electron Microscope (SEM) to observe the structural changes of the deposits and an X-Ray Diffraction (XRD) to calculate their grain size. The results show that, first, nickel deposits without saccharin addition has a pyramidal and crystal polyhedral structure while those with saccharin reflect a globular structure and colonial patterns. Secondly, the addition of 5g/L saccharin produces the smallest grain, 17.39 nm.
UR - http://www.scopus.com/inward/record.url?scp=85068985458&partnerID=8YFLogxK
U2 - 10.1088/1757-899X/541/1/012053
DO - 10.1088/1757-899X/541/1/012053
M3 - Conference article
AN - SCOPUS:85068985458
SN - 1757-8981
VL - 541
JO - IOP Conference Series: Materials Science and Engineering
JF - IOP Conference Series: Materials Science and Engineering
IS - 1
M1 - 012053
T2 - 2nd International Seminar on Metallurgy and Materials, ISMM 2018
Y2 - 25 September 2018 through 26 September 2018
ER -