One of the important phenomena in Electromigration (EM) is Blech Effect. The existence of Threshold Current Density-Length Product or EM Threshold has such fundamental and technological consequences in the design, manufacture, and testing of electronics. Temperature-dependence of Blech Product had been thermodynamically established and the real behavior of such interconnect materials have been extensively studied. The present paper reviewed the temperature-dependence of EM threshold in metallization lines of different materials and structure as found in relevant published articles. It is expected that the reader can see a big picture from the compiled data, which might be overlooked when it was examined in pieces.
|Journal||Journal of Physics: Conference Series|
|Publication status||Published - 5 May 2016|
|Event||4th International Conference on Science and Engineering in Mathematics, Chemistry and Physics 2016, ScieTech 2016 - Bali, Indonesia|
Duration: 30 Jan 2016 → 31 Jan 2016