Tarnish in the modified nickel-copper-manganese alloy systems containing additive elements

K. Wakasa, B. I. Sosrosoedirdjo, M. Yamaki

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

The nickel-copper-manganese (Ni-Cu-Mn) alloy systems containing additive elements, such as aluminium-indium (Al-In), aluminium-silicon (Al-Si), calcium-silicon-carbon (Ca-Si-C) and phosphorus-iron (P-Fe), were subjected to standardized tests for tarnish, and the releases of both nickel and copper in the same solutions as tarnish tests, were evaluated. The modified Ni-Cu-Mn alloy system showed a range of hardness between 200 and 400 when selected elements were added to harden or soften the matrix of the microstructures. Quantitative evaluations of tarnish (the colour change vector) indicated that these modified Ni-Cu-Mn alloy systems had very low values in the solutions for the tarnish test, representing lower solubilities of nickel and copper in their solutions.

Original languageEnglish
Pages (from-to)4273-4280
Number of pages8
JournalJournal of Materials Science
Volume26
Issue number16
DOIs
Publication statusPublished - 1 Jan 1991

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