Study of electrical property of Au-Ge eutectic solder alloys for high temperature electronics

Lau Fu Long, I. Made Riko, Wahyuaji Narottama Putra, Eric Phua Jian Rong, Lim Jun Zhang, Lim Ju Dy, Wong Chee Cheong, Chen Zhong, Vivek Chidambaram Nachiappan, Gan Che Lip

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

As deep earth oil exploration transits into deeper earth, it faces challenges in producing reliable microelectronics devices and sensors that will not degrade under a higher temperature and pressure environment. Numerous physical issues limit the manufacturing of this type of reliable microelectronics devices, especially those related to packaging materials and assembly of the microelectronics devices. One of the key requirements in reliability will be a continuous operating time of more than 500 h at 300°C. It is reported that the mechanical performance of a high temperature Au-Ge eutectic alloy is able to fulfill the minimum interconnection properties specified by the oil and gas exploration industry. However, the impact of thermal aging to Au-Ge eutectic alloy electrical property is not clear. The electrical resistivity of thermally aged Au-Ge eutectic alloys has been evaluated in this study. It is observed that the electrical resistivity decreases with thermal aging time until saturation. This effect is mainly contributed by the grain growth of Au, which results in a reduction in grain boundaries, thus causing a decrease in electrical resistivity. It has been determined that Au-Ge eutectic alloy is a suitable interconnection material in term of its electrical property to be used for high temperature electronics packaging.

Original languageEnglish
Title of host publicationProceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Pages30-33
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2012
Event2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012 - Singapore, Singapore
Duration: 5 Dec 20127 Dec 2012

Publication series

NameProceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012

Conference

Conference2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
CountrySingapore
CitySingapore
Period5/12/127/12/12

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