TY - GEN
T1 - Study of electrical property of Au-Ge eutectic solder alloys for high temperature electronics
AU - Long, Lau Fu
AU - Riko, I. Made
AU - Putra, Wahyuaji Narottama
AU - Rong, Eric Phua Jian
AU - Zhang, Lim Jun
AU - Dy, Lim Ju
AU - Cheong, Wong Chee
AU - Zhong, Chen
AU - Nachiappan, Vivek Chidambaram
AU - Lip, Gan Che
PY - 2012
Y1 - 2012
N2 - As deep earth oil exploration transits into deeper earth, it faces challenges in producing reliable microelectronics devices and sensors that will not degrade under a higher temperature and pressure environment. Numerous physical issues limit the manufacturing of this type of reliable microelectronics devices, especially those related to packaging materials and assembly of the microelectronics devices. One of the key requirements in reliability will be a continuous operating time of more than 500 h at 300°C. It is reported that the mechanical performance of a high temperature Au-Ge eutectic alloy is able to fulfill the minimum interconnection properties specified by the oil and gas exploration industry. However, the impact of thermal aging to Au-Ge eutectic alloy electrical property is not clear. The electrical resistivity of thermally aged Au-Ge eutectic alloys has been evaluated in this study. It is observed that the electrical resistivity decreases with thermal aging time until saturation. This effect is mainly contributed by the grain growth of Au, which results in a reduction in grain boundaries, thus causing a decrease in electrical resistivity. It has been determined that Au-Ge eutectic alloy is a suitable interconnection material in term of its electrical property to be used for high temperature electronics packaging.
AB - As deep earth oil exploration transits into deeper earth, it faces challenges in producing reliable microelectronics devices and sensors that will not degrade under a higher temperature and pressure environment. Numerous physical issues limit the manufacturing of this type of reliable microelectronics devices, especially those related to packaging materials and assembly of the microelectronics devices. One of the key requirements in reliability will be a continuous operating time of more than 500 h at 300°C. It is reported that the mechanical performance of a high temperature Au-Ge eutectic alloy is able to fulfill the minimum interconnection properties specified by the oil and gas exploration industry. However, the impact of thermal aging to Au-Ge eutectic alloy electrical property is not clear. The electrical resistivity of thermally aged Au-Ge eutectic alloys has been evaluated in this study. It is observed that the electrical resistivity decreases with thermal aging time until saturation. This effect is mainly contributed by the grain growth of Au, which results in a reduction in grain boundaries, thus causing a decrease in electrical resistivity. It has been determined that Au-Ge eutectic alloy is a suitable interconnection material in term of its electrical property to be used for high temperature electronics packaging.
UR - http://www.scopus.com/inward/record.url?scp=84879775473&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2012.6507045
DO - 10.1109/EPTC.2012.6507045
M3 - Conference contribution
AN - SCOPUS:84879775473
SN - 9781467345514
T3 - Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
SP - 30
EP - 33
BT - Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
T2 - 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Y2 - 5 December 2012 through 7 December 2012
ER -