Tin-Lead (Sn-Pb) alloy are the most widely used in Indonesia as solder materials. Lead is toxic element and it should be replaced with another element. The objective of this research is to study the lead free solder materials Sn-Zn with various contents of Zn. Tin was obtained from Bangka Island. The samples were characterized by the means of X-ray Diffractometer, Thermal analyzer, and Potentiodynamic Polarization. The results show that with different various Zn content, the structure is remained as body centered tetragonal with different crystal parameters. The different content of Zn in Sn-Zn Alloy have changed the melting point and the enthalpy as shown in the DSC results and also changed the microstructure of Sn-Zn alloy that confirmed with SEM. The Potentiodynamic Polarization shows that Sn-Zn with the content of Zn lower than eutectic concentration resulting the smallest corrosion rate. It can be concluded that Sn-Zn Alloy can be used as one among the other lead free solders.