TY - GEN
T1 - Silicon carbide (SiC) effect on mechanical properties and corrosion rates on composite Al/SiC and Al-Cu/SiC
AU - Anggara, B. S.
AU - Fahdiran, Riser
AU - Marpaung, Mangasi A.
AU - Soegijono, Bambang
N1 - Funding Information:
The authors gratefully acknowleged Rector Jakarta State University, the Ministry of Research, Technology and Higher Education, which has financed the research derived from the BLU FMIPA UNJ fund based on contract number: 23/PPK-FMIPA/BAP-PEN/V/2019, dated May 17, 2019.
Publisher Copyright:
© 2019 Author(s).
PY - 2019/11/7
Y1 - 2019/11/7
N2 - The preparation of Metal Matrix Composite (MMCs) Al/SiCp and Al-Cu/SiCp with the addition of silicon carbide powder (SiCp) and mixing with the hot sterring method has been done successfully. Material Al and Al-Cu melted in the temperature of 900°C then added SiC with variations (1, 2, 3, 4) weight % with the method of hot sterring. Microstructural observation with SEM shows both Al/SiCp and Al-Cu/SiCp grain boundaries are not obvious. Testing tensile test showed that the addition of Cu make Yield Stress tends to increase. While the corrosion rate of Al-Cu/SiCp is smaller when compared to Al/SiCp. Meaning Al/SiCp tends to be more corrosive when compared to Al-Cu/SiCp.
AB - The preparation of Metal Matrix Composite (MMCs) Al/SiCp and Al-Cu/SiCp with the addition of silicon carbide powder (SiCp) and mixing with the hot sterring method has been done successfully. Material Al and Al-Cu melted in the temperature of 900°C then added SiC with variations (1, 2, 3, 4) weight % with the method of hot sterring. Microstructural observation with SEM shows both Al/SiCp and Al-Cu/SiCp grain boundaries are not obvious. Testing tensile test showed that the addition of Cu make Yield Stress tends to increase. While the corrosion rate of Al-Cu/SiCp is smaller when compared to Al/SiCp. Meaning Al/SiCp tends to be more corrosive when compared to Al-Cu/SiCp.
UR - http://www.scopus.com/inward/record.url?scp=85075816395&partnerID=8YFLogxK
U2 - 10.1063/1.5132691
DO - 10.1063/1.5132691
M3 - Conference contribution
AN - SCOPUS:85075816395
T3 - AIP Conference Proceedings
BT - 8th National Physics Seminar 2019
A2 - Bakri, Fauzi
A2 - Wibowo, Firmanul Catur
A2 - Sugihartono, Iwan
A2 - Budi, Esmar
A2 - Indrasari, Widyaningrum
A2 - Umiatin, null
A2 - Prayitno, Teguh Budi
PB - American Institute of Physics Inc.
T2 - 8th National Physics Seminar 2019
Y2 - 29 June 2019 through 30 June 2019
ER -