TY - JOUR
T1 - Seedless-electroplating process development for micro-features realization
AU - Whulanza, Yudan
AU - Sitanggang, Tito
AU - Istiyanto, Jos
AU - Supriadi, Sugeng
N1 - Publisher Copyright:
© IJTech 2015.
PY - 2015
Y1 - 2015
N2 - This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5μm. Moreover, a resolution of ±10μm and roughness (Ra) of ±0.31μm was achieved during the metal deposition process.
AB - This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5μm. Moreover, a resolution of ±10μm and roughness (Ra) of ±0.31μm was achieved during the metal deposition process.
KW - LIGA
KW - Maskless-lithography
KW - Seedless-electroplating
KW - Wet chemical etching
UR - http://www.scopus.com/inward/record.url?scp=84954144075&partnerID=8YFLogxK
U2 - 10.14716/ijtech.v6i6.1724
DO - 10.14716/ijtech.v6i6.1724
M3 - Article
AN - SCOPUS:84954144075
SN - 2086-9614
VL - 6
SP - 1050
EP - 1056
JO - International Journal of Technology
JF - International Journal of Technology
IS - 6
ER -