Seedless-electroplating process development for micro-features realization

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor process with tolerable results for nickel electroplating. This study reports the results of various voltages on seedless-electroplating over time, where the optimal combination occurs at an exposure of 7.5 Volts of Direct Current (VDC) for 30 seconds. The thickness of electroplated metal is at a range of ±1.5μm. Moreover, a resolution of ±10μm and roughness (Ra) of ±0.31μm was achieved during the metal deposition process.

Original languageEnglish
Pages (from-to)1050-1056
Number of pages7
JournalInternational Journal of Technology
Volume6
Issue number6
DOIs
Publication statusPublished - 1 Jan 2015

Keywords

  • LIGA
  • Maskless-lithography
  • Seedless-electroplating
  • Wet chemical etching

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