| Original language | English |
|---|---|
| Patent number | EC00202230402 |
| Filing date | 19/05/22 |
| Publication status | Published - 19 May 2022 |
Prototype Aplikasi Bonding
Ari Nurfikri (Inventor), Supriadi (Inventor), Triana Karnadipa (Inventor)
Research output: Intelectual Property › Copyright