Pool boiling of nanofluids in vertical porous media

Ridho Irwansyah, Nandy Setiadi Djaya Putra

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)


The development of electronic components such as microprocessor requires a better thermal management system to overcome the high heat flux produce by the component. The method to absorb the heat produce by the microprocessor is still use the conduction or either natural or free convection which still in a single phase heat transfer. One of heat transfer method that suitable for a high heat flux application is pool boiling which has a two order of magnitude higher than of a single phase heat transfer and does not require a pump to move the fluid. In this study has been conducted the pool boiling experiment with four different porous media surface which are sintered copper 300 μm and 400 μm, copper screen mesh and stainless steel screen mesh with four different fluid which are Al2O3-Water 1%, 3% and 5%. The sintered copper 400 μm has shown a better heat transfer performance compared to the other porous media. The Water, Al2O3-Water 5% has shown a performance no better than Al2O3-Water 1% and 3%.

Original languageEnglish
Title of host publicationAdvances in Thermofluids
Number of pages5
Publication statusPublished - 2013
Event5th International Meeting on Advances of Thermofluids, IMAT 2012 - Bintan Island, Indonesia
Duration: 12 Nov 201213 Nov 2012

Publication series

NameApplied Mechanics and Materials
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482


Conference5th International Meeting on Advances of Thermofluids, IMAT 2012
CityBintan Island


  • Nanofluids
  • Pool boiling
  • Screen mesh
  • Sintered copper


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