The development of electronic components such as microprocessor requires a better thermal management system to overcome the high heat flux produce by the component. The method to absorb the heat produce by the microprocessor is still use the conduction or either natural or free convection which still in a single phase heat transfer. One of heat transfer method that suitable for a high heat flux application is pool boiling which has a two order of magnitude higher than of a single phase heat transfer and does not require a pump to move the fluid. In this study has been conducted the pool boiling experiment with four different porous media surface which are sintered copper 300 μm and 400 μm, copper screen mesh and stainless steel screen mesh with four different fluid which are Al2O3-Water 1%, 3% and 5%. The sintered copper 400 μm has shown a better heat transfer performance compared to the other porous media. The Water, Al2O3-Water 5% has shown a performance no better than Al2O3-Water 1% and 3%.