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Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)
F. X. Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, C. L. Gan
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
11
Citations
(Scopus)