Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

F. X. Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, C. L. Gan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Citations (Scopus)

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Engineering & Materials Science