Oxide dispersion strengthened (ODS) alloys exhibit superior high temperature properties compared to conventional alloys. Joining of these ODS alloys poses a challenge and limits their application in the industry. The transient liquid phase (TLP) bonding technique was employed in the present study to join two ferritic ODS alloys, MA956 and PM2000, using physical vapor deposited thin-film boron as an interlayer. Successful bonds with minimal disruption of the substrate microstructure and limited second phase precipitation at the bond-line were achieved when substrates were joined in the fine grained condition, under an applied bonding stress, with substrate orientation parallel to the extrusion direction.
|Number of pages||5|
|Journal||Transactions of the Indian Institute of Metals|
|Publication status||Published - Apr 2006|