Investigating the mechanical performance of mycelium biocomposite using Oil Palm Empty Fruit Bunch (OPEFB) fiber and pine sap bioresin as sandwich insulation panels

Building and construction waste contributes to global carbon emissions, leading to the need to seek alternative materials that are more environmentally friendly. Mycelium Biocomposite (MB) is a sustainable material that utilizes agricultural waste as its main substrate and can be degraded after-use. This study aimed to investigate mechanical performance of additional layers in sandwich panel fabrication of MB. The experiment was conducted in two phases including (1) Composite 1: Oil Palm Empty Fruit Bunch (OPEFB) fiber layer with pine resin and (2) Composite 2: MB sandwich panel. In Composite 1, the mechanical test results showed the S50 sample (50 % fiber and 50 % resin) had the highest tensile strength of 0.18 N/mm² and was selected as the surface layer. In Composite 2, the variable of layer binder was produced using mycelium hyphae (MB-M) and resin (MB-R). The results of the physical, mechanical, and thermal properties tests were compared with the JIS A 5905:2003 standard and previous studies. The MB sample (no layer) had the best mechanical and thermal conductivity values due to the binding method effects, such as flexural strength at 25.38 N/mm² and bending strength at 0.53 N/mm². MB-M showed incomplete drying that caused lower tensile strength and higher thermal conductivity. Meanwhile, MB-R showed mechanical values similar to MB, such as flexural strength at 21.22 N/mm² and bending strength at 0.52 N/mm². Yet, MB had higher thermal conductivity, where MB-R showed 0.1558 W/mK and MB showed 0.1037 W/mK, due to Composite 1 addition. This study suggests the development of MB thermal values and considers its application as non-structural insulation panels.