ICSITech 2019 Welcome Message from IEEE Indonesia

Wisnu Jatmiko, Kurnianingsih

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceeding - 2019 5th International Conference on Science in Information Technology
Subtitle of host publicationEmbracing Industry 4.0: Towards Innovation in Cyber Physical System, ICSITech 2019
EditorsAwang Hendrianto Pratomo, Andri Pranolo, Leonel Hernandez, Rafal Drezewski, Roman Voliansky, Mohamad Shanudin Zakaria, Bagus Muhammad Akbar, Shoffan Saifullah, Ahmad Taufiq Akbar, Rochmat Husaini, Heriyanto Heriyanto, Andiko Putro Suryotomo, Vynska Amalia Permadi, Sylvert Prian Tahalea
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728123806
DOIs
Publication statusPublished - Oct 2019
Event5th International Conference on Science in Information Technology, ICSITech 2019 - Yogyakarta, Indonesia
Duration: 23 Oct 201924 Oct 2019

Publication series

NameProceeding - 2019 5th International Conference on Science in Information Technology: Embracing Industry 4.0: Towards Innovation in Cyber Physical System, ICSITech 2019

Conference

Conference5th International Conference on Science in Information Technology, ICSITech 2019
CountryIndonesia
CityYogyakarta
Period23/10/1924/10/19

Cite this

Jatmiko, W., & Kurnianingsih (2019). ICSITech 2019 Welcome Message from IEEE Indonesia. In A. H. Pratomo, A. Pranolo, L. Hernandez, R. Drezewski, R. Voliansky, M. S. Zakaria, B. M. Akbar, S. Saifullah, A. T. Akbar, R. Husaini, H. Heriyanto, A. P. Suryotomo, V. A. Permadi, & S. P. Tahalea (Eds.), Proceeding - 2019 5th International Conference on Science in Information Technology: Embracing Industry 4.0: Towards Innovation in Cyber Physical System, ICSITech 2019 [8987573] (Proceeding - 2019 5th International Conference on Science in Information Technology: Embracing Industry 4.0: Towards Innovation in Cyber Physical System, ICSITech 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSITech46713.2019.8987573