Electrolyte Solution Stirring Effect on Deposition Rate, Crystallographic Orientation, and Electrochemical Behaviour of Ni Film

Stirring the electrolyte meanwhile electrodeposition process is running may influence the properties of the forming films. In this work, the electrodeposition of copper (Cu) over aluminium (Al) alloy was performed. Subsequently, the electrodeposition of nickel (Ni) onto the formed Cu layer was conducted. In order to enhance the films properties, some various stirring speeds then are implied on the plating solution of the Ni electrodeposition process. The synthesized of Ni films were analysed by means of both X-ray diffraction (XRD) and a potentiostat equipment. The sample made shows different physical properties before and after electrodeposition based on sample weighed to examine the deposition rate. XRD patterns confirmed that all samples have a face-centered cubic (fcc) crystal structures with a space group of Fm-3m. Stirring speed play an important role of an inverse relationship with deposition rate, crystallite size, lattice strain, and corrosion rate. The sample that was made using the highest stirring speed yield a better corrosion resistance at around 0.239 mmpy due to less lattice strain.