TY - JOUR
T1 - Electrodeposition of paramagnetic copper film under magnetic field on paramagnetic aluminum alloy substrates
AU - Soegijono, Bambang
AU - Susetyo, Ferry Budhi
AU - Yusmaniar,
AU - Fajrah, Musfirah Cahya
N1 - Funding Information:
The author thanks Ministry of Research, Technology and Higher Education of the Republic of Indonesia for financial support Hibah Penelitian Disertasi Doktor No: NKB-2999/UN2.RST/HKP.05.00 /2020.
Publisher Copyright:
Copyright © 2020 The Author(s).
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2020
Y1 - 2020
N2 - Electrodeposition of paramagnetic copper (Cu) from a sulfate solution was investigated under magnetic fields and two different current densities. Static magnetic fields have been used during electrodeposition of para-magnetic Cu onto paramagnetic aluminum (Al) substrate to enhance the deposition rate and to alter crystallographic orientation and morphology of the film. The magnetic field might be attributed to the field-induced convection that disrupts the depletion layer near the electrode and that might also be correlated to Cu, Al, and oxygen dissolved in the solution as paramagnetic materials. An X-ray diffractometry, a scanning electron microscope with energy dispersive spectrometry, a potentiostat, and a digital camera were used for characterizing the crystal structure, morphology, the electrochemical behavior, and wettability, respectively. The results show that, at the current density of 10 mA cm-2, raising the magnetic field from 800 to 1400 G increases the cathode current efficien-cy and alters the electrochemical behavior, the crystal growth, and the crystallite size. At the current density of 30 mA cm-2, the magnetic field alters the growth and crystallographic orientation. The static magnetic field exposed during electrodeposition of Cu onto the Al alloy can control the film properties, especially crystallographic orientation and the oxygen content.
AB - Electrodeposition of paramagnetic copper (Cu) from a sulfate solution was investigated under magnetic fields and two different current densities. Static magnetic fields have been used during electrodeposition of para-magnetic Cu onto paramagnetic aluminum (Al) substrate to enhance the deposition rate and to alter crystallographic orientation and morphology of the film. The magnetic field might be attributed to the field-induced convection that disrupts the depletion layer near the electrode and that might also be correlated to Cu, Al, and oxygen dissolved in the solution as paramagnetic materials. An X-ray diffractometry, a scanning electron microscope with energy dispersive spectrometry, a potentiostat, and a digital camera were used for characterizing the crystal structure, morphology, the electrochemical behavior, and wettability, respectively. The results show that, at the current density of 10 mA cm-2, raising the magnetic field from 800 to 1400 G increases the cathode current efficien-cy and alters the electrochemical behavior, the crystal growth, and the crystallite size. At the current density of 30 mA cm-2, the magnetic field alters the growth and crystallographic orientation. The static magnetic field exposed during electrodeposition of Cu onto the Al alloy can control the film properties, especially crystallographic orientation and the oxygen content.
KW - Al alloy
KW - Cu Films
KW - Magnetic field
KW - Paramagnetic
UR - http://www.scopus.com/inward/record.url?scp=85096752204&partnerID=8YFLogxK
U2 - 10.1380/EJSSNT.2020.281
DO - 10.1380/EJSSNT.2020.281
M3 - Article
AN - SCOPUS:85096752204
VL - 18
SP - 281
EP - 288
JO - e-Journal of Surface Science and Nanotechnology
JF - e-Journal of Surface Science and Nanotechnology
SN - 1348-0391
ER -