Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics

F. L. Lau, Riko I Made, W. N. Putra, J. Z. Lim, V. C. Nachiappan, J. L. Aw, C. L. Gan

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

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Keyphrases

Material Science

Engineering