TY - GEN
T1 - Effect of substrate grain size and orientation on the transient liquid-phase bonding of ferritic oxide dispersion strengthened alloys
AU - Krishnardula, Venu G.
AU - Sofyan, Nofrijon Bin Imam
AU - Fergus, Jeffrey W.
AU - Gale, William F.
PY - 2005
Y1 - 2005
N2 - This paper reports the microstructural features of transient liquid phase (TLP) bonding of two mechanically alloyed (MA) ferritic oxide dispersion strengthened (ODS) alloys, MA956 and PM2000. The influence of the substrate faying surface orientation with respect to the extrusion direction on the bond microstructural development is investigated. Physical vapor deposited boron thin films were used as interlayers for bonding. Post bond heat treatment (PBHT) was performed to induce recrystallization across the bondline. Better microstructural continuity occurred when the substrates were used in the unrecrystallized fine grain condition, with the faying surface aligned in the working direction, as compared to the substrates aligned in the direction normal to the working direction.
AB - This paper reports the microstructural features of transient liquid phase (TLP) bonding of two mechanically alloyed (MA) ferritic oxide dispersion strengthened (ODS) alloys, MA956 and PM2000. The influence of the substrate faying surface orientation with respect to the extrusion direction on the bond microstructural development is investigated. Physical vapor deposited boron thin films were used as interlayers for bonding. Post bond heat treatment (PBHT) was performed to induce recrystallization across the bondline. Better microstructural continuity occurred when the substrates were used in the unrecrystallized fine grain condition, with the faying surface aligned in the working direction, as compared to the substrates aligned in the direction normal to the working direction.
KW - Grain size
KW - Orientation
KW - Oxide dispersion strengthened alloys
KW - Transient liquid-phase bonding
UR - http://www.scopus.com/inward/record.url?scp=33751517454&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:33751517454
SN - 0871708426
SN - 9780871708427
T3 - ASM Proceedings of the International Conference: Trends in Welding Research
SP - 861
EP - 865
BT - Trends in Welding Research - Proceedings of the 7th International Conference
T2 - 7th International Conference on Trends in Welding Research
Y2 - 16 May 2005 through 20 May 2005
ER -