Effect of saccharin as additive in nickel electroplating on SPCC steel

Rini Riastuti, Achmad Rifki, Falah Herdino, Cika Ramadini, Sonia Taruli Siallagan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of saccharin on the reduction of crystallite size and nickel electroplating properties was investigated. There are some techniques to obtain nanocrystalline coating and to reduce crystallite size in electrodeposition such as current density, mode of electrodeposition, and organic additive, one of which is saccharin. This charges of 0, 0.5, 1.0, 5.0, 10†g/l saccharin, air agitation, current density 6 A/dm2, and with electrolyte solution generally used in nickel electroplating industry is Watts nickel solution. The crystallite size of nickel plating was examined by X-Ray Diffraction, coating thickness was examined by thickness meter, hardness of plating were examined by Vickers hardness, corrosion rate was examined by salt spray test, and adhesive strength was examined by heat and quench test. From the result, it was found that the lowest crystallite size was obtained at 35 nm (10 g/L saccharin), the highest hardness was obtained at 593 HV (10 g/L), the best corrosive level is obtained in grade 8 which is 0.1% (0, 5, 10 g/L saccharin) of the corroded area, and the best adhesive level is obtained no blister in the surface (0, 5, 10 g/L). The increasing number of saccharin given will lead to decreasing crystallite size of plating and corrosion rate, and also will lead to the increasing hardness and adhesive strength.

Original languageEnglish
Title of host publication6th International Conference on Science and Engineering in Mathematics, Chemistry and Physics
Subtitle of host publicationScieTech18: The Nature Math - The Science
EditorsFord Lumban Gaol, P.N. Gajjar, Jamil Akhtar
PublisherAmerican Institute of Physics Inc.
ISBN (Electronic)9780735417694
DOIs
Publication statusPublished - 20 Nov 2018
Event6th International Conference on Science and Engineering in Mathematics, Chemistry and Physics 2018, ScieTech 2018 - Tugu Tani, Jakarta, Indonesia
Duration: 20 Jan 201821 Jan 2018

Publication series

NameAIP Conference Proceedings
Volume2043
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

Conference6th International Conference on Science and Engineering in Mathematics, Chemistry and Physics 2018, ScieTech 2018
CountryIndonesia
CityTugu Tani, Jakarta
Period20/01/1821/01/18

Keywords

  • crystallite size
  • Electroplating
  • nanocrystalline
  • nickel
  • saccharin
  • watts bath

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  • Cite this

    Riastuti, R., Rifki, A., Herdino, F., Ramadini, C., & Siallagan, S. T. (2018). Effect of saccharin as additive in nickel electroplating on SPCC steel. In F. L. Gaol, P. N. Gajjar, & J. Akhtar (Eds.), 6th International Conference on Science and Engineering in Mathematics, Chemistry and Physics: ScieTech18: The Nature Math - The Science [020012] (AIP Conference Proceedings; Vol. 2043). American Institute of Physics Inc.. https://doi.org/10.1063/1.5080031