@inbook{478e0492ef6f4a1982998e07c66bd2d4,
title = "Curing Kinetics of Epoxy Adhesive by Non-Isothermal DSC",
abstract = "Non-isothermal DSC has been used to investigate the curing kinetics of epoxy adhesives (DGEBA-cycloaliphatic amine). The epoxy samples were scanned on DSC with five heating rates (5oC/min, 7.5oC/min, 10oC/min, 12.5oC/min, and 15oC/min). The curing kinetics were obtained through ASTM standards E2890 and E698 (the Ozawa and Kissinger methods). The kinetic parameters obtained include Ea (activation energy), A (pre-exponential factor), and n (reaction order). The activation energy calculated from the Kissinger and Ozawa method was slightly different but insignificant. The reaction rate (dα/dt) and degree of curing/conversion (α) relationship towards temperature (T), and time (t) was also investigated. The curing process's reaction rate (dα/dt) has maximum value; it can no longer increase after a specific conversion rate (α).",
keywords = "adhesive, curing kinetics, DSC, Epoxy, Kissinger, non-isothermal, Ozawa",
author = "Dewi, {Wiwiek Utami} and Rizky Sutrisna and Heru Supriyatno and Sotya Astutiningsih and Mochamad Chalid",
note = "Publisher Copyright: {\textcopyright} 2024 Trans Tech Publications Ltd, Switzerland.",
year = "2024",
doi = "10.4028/p-E5VlmG",
language = "English",
series = "Materials Science Forum",
publisher = "Trans Tech Publications Ltd",
pages = "145--152",
booktitle = "Materials Science Forum",
}