Compliant electrostatic chuck based on hairy microstructure

Shigeki Saito, Fumiaki Soda, Radon Dhelika, Kunio Takahashi, Wataru Takarada, Takeshi Kikutani

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

An electrostatic chuck (ESC) is a device used to clamp and transport flat-surfaced objects such as thin semiconductor wafers. Working by the principle of electrostatic force, its functionality is limited in handling objects with rough surfaces, as the attractive forces at work are significantly reduced. To improve this weak point, by employing 70 μm diameter polymer-based electrostatic inductive fibers with a conductive core, we develop a device prototype with an adhesional mechanism having a hairy microstructure with appropriate mechanical compliance. We theoretically and experimentally investigate how the prototype works, and how the fibers' mechanical compliance affects the performance of ESC.

Original languageEnglish
Article number015019
JournalSmart Materials and Structures
Volume22
Issue number1
DOIs
Publication statusPublished - 1 Jan 2013

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