@inproceedings{b347d7b933fa47c8bae1192022ce42b6,
title = "Characterization of bismuth in Sn-based as safe environment solder material",
abstract = "The lead-free solder materials development served as urgent, due to the implementation of Restriction of Hazardous Substances (RoHS). However, another material for a lead-free solder carry several drawbacks, namely many of intermetallic growth (IMC), which has slightly higher in melting point. One of the methods used to make lead-free solder is by supplementing another alloy substance. Among the expectant alloy substances is by varying Bismuth (Bi) content. Thermal Analyzer, X-ray Diffraction and Potentiodynamic Polarization were used for characterization. The results showed the decrease in melting point. The structure of Bi-doped Sn showed single-phase tetragonal Sn. Different crystal parameters have been obtained. From Potentiodynamic Polarization test, the samples showed different corrosion rate. In conclusion, Sn-Bi lead-free solder is a potential candidate in replacing the Tin-Lead solder materials which is now banned.",
keywords = "RoHS, Sn-Bi, X-ray difraction",
author = "W. Firdaus and B. Soegijono and A. Sudarmadji and Trisnadi, {A. D.}",
note = "Publisher Copyright: {\textcopyright} 2020 Author(s).; 5th International Symposium on Current Progress in Mathematics and Sciences, ISCPMS 2019 ; Conference date: 09-07-2019 Through 10-07-2019",
year = "2020",
month = jun,
day = "1",
doi = "10.1063/5.0007974",
language = "English",
series = "AIP Conference Proceedings",
publisher = "American Institute of Physics Inc.",
editor = "Terry Mart and Djoko Triyono and Ivandini, {Tribidasari Anggraningrum}",
booktitle = "Proceedings of the 5th International Symposium on Current Progress in Mathematics and Sciences, ISCPMS 2019",
address = "United States",
}