The lead-free solder materials development served as urgent, due to the implementation of Restriction of Hazardous Substances (RoHS). However, another material for a lead-free solder carry several drawbacks, namely many of intermetallic growth (IMC), which has slightly higher in melting point. One of the methods used to make lead-free solder is by supplementing another alloy substance. Among the expectant alloy substances is by varying Bismuth (Bi) content. Thermal Analyzer, X-ray Diffraction and Potentiodynamic Polarization were used for characterization. The results showed the decrease in melting point. The structure of Bi-doped Sn showed single-phase tetragonal Sn. Different crystal parameters have been obtained. From Potentiodynamic Polarization test, the samples showed different corrosion rate. In conclusion, Sn-Bi lead-free solder is a potential candidate in replacing the Tin-Lead solder materials which is now banned.