TY - GEN
T1 - Atmospheric pressure plasma functionalization of carbon nanotube dot-array with two-stage plasma treatments for the development of bio-chip sensors
AU - Abuzairi, Tomy
AU - Nagatsu, Masaaki
AU - Poespawati, Nji Raden
AU - Purnamaningsih, Retno Wigajatri
AU - Okada, Mitsuru
AU - Mochizuki, Yohei
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/1/7
Y1 - 2016/1/7
N2 - An atmospheric pressure plasma jet (APPJ) technique was developed to functionalize amino groups to obtain plasma-functionalized carbon nanotube (CNT) dot-array as a precursor of biomolecules of the bio-chip sensor. To realize bio-chip sensors based on CNT, it is needed the proper control of their surface functionalization. An APPJ technique for CNT functionalization was implemented in the two-stages: (1) pre-treatment with by Ar gas -500 V dc bias and (2) post-treatment by Ar and NH3 gas mixture without substrate bias. Two-stages plasma treatment are important factors for performing surface functionalization in the APPJ, without any pre-treatment or when we only applying the post-treatment, no functionalization occur in the CNT dot-array.
AB - An atmospheric pressure plasma jet (APPJ) technique was developed to functionalize amino groups to obtain plasma-functionalized carbon nanotube (CNT) dot-array as a precursor of biomolecules of the bio-chip sensor. To realize bio-chip sensors based on CNT, it is needed the proper control of their surface functionalization. An APPJ technique for CNT functionalization was implemented in the two-stages: (1) pre-treatment with by Ar gas -500 V dc bias and (2) post-treatment by Ar and NH3 gas mixture without substrate bias. Two-stages plasma treatment are important factors for performing surface functionalization in the APPJ, without any pre-treatment or when we only applying the post-treatment, no functionalization occur in the CNT dot-array.
KW - atmospheric pressure plasma
KW - bio-chip sensors
KW - carbon nanotube
KW - functionalization
KW - two-stage plasma treatment
UR - http://www.scopus.com/inward/record.url?scp=84963852342&partnerID=8YFLogxK
U2 - 10.1109/QiR.2015.7374885
DO - 10.1109/QiR.2015.7374885
M3 - Conference contribution
AN - SCOPUS:84963852342
T3 - 14th International Conference on QiR (Quality in Research), QiR 2015 - In conjunction with 4th Asian Symposium on Material Processing, ASMP 2015 and International Conference in Saving Energy in Refrigeration and Air Conditioning, ICSERA 2015
SP - 16
EP - 18
BT - 14th International Conference on QiR (Quality in Research), QiR 2015 - In conjunction with 4th Asian Symposium on Material Processing, ASMP 2015 and International Conference in Saving Energy in Refrigeration and Air Conditioning, ICSERA 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th International Conference on QiR (Quality in Research), QiR 2015
Y2 - 10 August 2015 through 13 August 2015
ER -