TY - JOUR
T1 - Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment
AU - Putra, Nandy
AU - Yanuar,
AU - Iskandar, Ferdiansyah N.
N1 - Funding Information:
The Authors thank the Directorate on Research and the Community Service University of Indonesia for financial support.
PY - 2011/10
Y1 - 2011/10
N2 - Microprocessor power dissipation is constantly increasing. An increase in microprocessor size has also resulted in higher heat fluxes. The growth of information technology has rapidly increased over the past few years, causing an increase in the demand for a microprocessor that has a very high computing ability. The previous generation of central processing units (CPU) had 1.17 billion transistors planted in it, which indicates that a significant amount of heat was generated. The total heat dissipation resulting from a high end CPU is approximately 110-140. W, which will increase if the CPU voltage and frequency increase. Conventional air-cooled cooling systems are no longer adequate to remove these heat fluxes. For a number of applications, direct air-cooling systems will have to be replaced or enhanced by other high performance compact cooling techniques. In this study, the application of nanofluids as the working fluid on a heat pipe liquid-block combined with thermoelectric cooling is investigated. The type and effect of volume concentrations of nanofluids, coolant temperature, and thermoelectricsystem as heat pumps of a PC on the CPU's temperature are considered. The results obtained from this technique are compared to those from other conventional cooling techniques. The heat pipe liquid-block combined with the thermoelectric system has a significant effect on heat transfer from the CPU. The higher thermal performance heat pipe liquid-block and thermoelectric cooled system with nanofluids proved its potential as a working fluid.
AB - Microprocessor power dissipation is constantly increasing. An increase in microprocessor size has also resulted in higher heat fluxes. The growth of information technology has rapidly increased over the past few years, causing an increase in the demand for a microprocessor that has a very high computing ability. The previous generation of central processing units (CPU) had 1.17 billion transistors planted in it, which indicates that a significant amount of heat was generated. The total heat dissipation resulting from a high end CPU is approximately 110-140. W, which will increase if the CPU voltage and frequency increase. Conventional air-cooled cooling systems are no longer adequate to remove these heat fluxes. For a number of applications, direct air-cooling systems will have to be replaced or enhanced by other high performance compact cooling techniques. In this study, the application of nanofluids as the working fluid on a heat pipe liquid-block combined with thermoelectric cooling is investigated. The type and effect of volume concentrations of nanofluids, coolant temperature, and thermoelectricsystem as heat pumps of a PC on the CPU's temperature are considered. The results obtained from this technique are compared to those from other conventional cooling techniques. The heat pipe liquid-block combined with the thermoelectric system has a significant effect on heat transfer from the CPU. The higher thermal performance heat pipe liquid-block and thermoelectric cooled system with nanofluids proved its potential as a working fluid.
KW - Electronic cooling
KW - Heat pipe liquid-block
KW - Heat transfer
KW - Nanofluid
KW - Thermoelectric
UR - http://www.scopus.com/inward/record.url?scp=79960995074&partnerID=8YFLogxK
U2 - 10.1016/j.expthermflusci.2011.04.015
DO - 10.1016/j.expthermflusci.2011.04.015
M3 - Article
AN - SCOPUS:79960995074
VL - 35
SP - 1274
EP - 1281
JO - Experimental Thermal and Fluid Science
JF - Experimental Thermal and Fluid Science
SN - 0894-1777
IS - 7
ER -