TY - JOUR
T1 - Analysis of Damage Area of Fiberglass/Polyester Bi-Panel Composite with Tapioca Starch Filler Through a Ballistic Test
AU - Koto, N.
AU - Soegijono, B.
N1 - Publisher Copyright:
© 2019 Published under licence by IOP Publishing Ltd.
PY - 2019/4/16
Y1 - 2019/4/16
N2 - Analysis of the damaged area due to ballistic impact was carried out on fiberglass/polyester bi-panel composites with tapioca starch as a filler. The Bi-Panel composite consists of two panels with a thickness of 4 mm each. Each panel consists of unsaturated polyester resin BQTN 157 and reinforced with constant volume of woven roving S-glass and variation of tapioca starch of 40% and 50% vol. as a filler. The characterization has been done by means of Fourier-transform infrared (FTIR) spectroscopy, x-ray diffractometer (XRD) and impact test with calibre ammunition of 9 mm bullet FN gun. The results showed the influence of tapioca starch on the strength of composite panels against the high impact of a bullet.
AB - Analysis of the damaged area due to ballistic impact was carried out on fiberglass/polyester bi-panel composites with tapioca starch as a filler. The Bi-Panel composite consists of two panels with a thickness of 4 mm each. Each panel consists of unsaturated polyester resin BQTN 157 and reinforced with constant volume of woven roving S-glass and variation of tapioca starch of 40% and 50% vol. as a filler. The characterization has been done by means of Fourier-transform infrared (FTIR) spectroscopy, x-ray diffractometer (XRD) and impact test with calibre ammunition of 9 mm bullet FN gun. The results showed the influence of tapioca starch on the strength of composite panels against the high impact of a bullet.
UR - http://www.scopus.com/inward/record.url?scp=85065573972&partnerID=8YFLogxK
U2 - 10.1088/1742-6596/1191/1/012055
DO - 10.1088/1742-6596/1191/1/012055
M3 - Conference article
AN - SCOPUS:85065573972
SN - 1742-6588
VL - 1191
JO - Journal of Physics: Conference Series
JF - Journal of Physics: Conference Series
IS - 1
M1 - 012055
T2 - 4th International Symposium on Frontier of Applied Physics, ISFAP 2018
Y2 - 1 November 2018 through 2 November 2018
ER -