The ternary nickel-copper-manganese (Ni-Cu-Mn) cast alloys were studied on hardening by the addition of elements such as aluminium and indium to the ternary alloys. Tensile tests showed that both the 20 Ni-40 Cu-40 Mn (which has the lowest melting temperature of all the Ni-Cu-Mn ternary alloys investigated) and the 50 Ni-30 Cu-20 Mn (with the highest melting temperature) exhibited a ductile behaviour. Dendritic structures seen by optical microscopy were constituted of ternary alloys containing aluminium and indium and the amount of dendritic structures increased in the indium-containing alloys rather than in the aluminium containing alloys, and as a result the hardness (VHN) had larger values in the latter alloy than in the former alloy.
|Number of pages||6|
|Journal||Journal of Materials Science|
|Publication status||Published - 1 Oct 1989|