Keyphrases
Quench Medium
100%
Nanofluid
86%
Thermal Conductivity
57%
Sodium Dodecyl Benzene Sulfonate
45%
Surfactant
42%
Heat-treated Steel
32%
Cooling Rate
31%
Heat Treatment Process
30%
Water-based
28%
Through Silicon via
27%
Quenchant
26%
Mechanical Properties
25%
Particle Size
25%
Polyethylene Glycol
24%
Quenching Process
23%
Annealing
22%
Heat Treatment
22%
Nanoparticles
21%
Multi-walled Carbon Nanotubes (MWCNTs)
20%
Treatment Application
20%
Microstructure
20%
Carbide Layer
19%
Microfluid
19%
Carbon Nanotubes
19%
Carbon Particles
18%
S45C
18%
Protrusion
17%
Holding Time
17%
High Thermal Conductivity
16%
Water-based Nanofluid
16%
S45C Steel
16%
Retained Austenite
16%
Cetyltrimethylammonium Bromide
15%
Distilled Water
15%
Carbon Nanofluid
15%
Microparticles
15%
Medium Carbon Steel
15%
Wear Resistance
14%
Printed Circuit Board
14%
Cu Protrusion
14%
Steel Sample
14%
Dispersed Particles
13%
Solid Particles
13%
Surfactant Addition
13%
Field Emission Scanning Electron Microscopy (FE-SEM)
13%
Reactive Deposition
13%
Sub-zero Treatment
13%
Gallium
13%
AuGe
13%
High Temperature Electronics
13%
Material Science
Heat Treatment
73%
Thermal Conductivity
70%
Surface Active Agent
57%
Sodium
44%
Nanoparticle
36%
Carbon Nanotube
32%
Silicon
29%
Electronic Circuit
26%
Carbon Steel
25%
Polyethylene Glycol
23%
Scanning Electron Microscopy
22%
Carbon Particle
21%
Surface (Surface Science)
19%
Microparticle
19%
Wear Resistance
18%
Carbide
15%
Composite Material
14%
Medium-Carbon Steels
14%
Tool Steel
13%
Stir Casting
13%
Graphene Oxide
13%
Austenite
13%
Gallium
13%
Annealing
11%
Energy-Dispersive X-Ray Spectroscopy
11%
Oil Exploration
10%
Thermal Aging
10%
Particle Morphology
10%
Thermal Stability
9%
Electrical Resistivity
9%
Titanium Dioxide
8%
Metallography
8%
Microhardness
8%
Electron Backscatter Diffraction
7%
X-Ray Diffraction
7%
Coupling Agent
6%
Asphalt
6%
Cobalt
6%
Thermogravimetric Analysis
6%
Aluminum
6%
Physical Vapor Deposition
6%
Cationic Surfactant
6%
Comminution
6%
Film
6%
Lignin
6%
Reducing Agent
6%
Anionic Surfactant
6%
Nonionic Surfactant
6%
Electrical Resistance
6%
Thermal Analysis
6%
Engineering
Nanofluid
61%
Cooling Rate
34%
Thermal Conductivity
34%
Printed Circuit Board
26%
Carbon Steel
25%
Heat Treatment
24%
Heat Treatment Process
24%
Nanoparticle
21%
Wear Resistance
20%
Surfactant
20%
Tool Steel
19%
Holding Time
19%
Quenchant
18%
Retained Austenite
17%
Steel Sample
17%
Steel Heat Treatment
16%
Ball Mill
15%
Three Dimensional Integrated Circuits
15%
Pyrolysis
14%
Deposition Process
13%
Temperature Time
13%
Eutectics
13%
Quenched Sample
12%
Scanning Electron Microscope
11%
Field Emission Scanning Electron Microscope
11%
Automotive Component
10%
Carbon Nanoparticle
10%
Austenitizing Temperature
10%
High Thermal Conductivity
10%
Copper (Cu)
9%
Annealing Temperature
9%
Microhardness
9%
Metallography
9%
Layer Coating
8%
Ray Diffraction
8%
Rapid Quenching
8%
Hardness Testing
8%
Optical Microscope
8%
Hardness Value
8%
Bainite
7%
Dimensional Stability
7%
Energy dispersive spectrometry
7%
Medium-Carbon Steels
7%
Rapid Cooling
7%
Quenching Medium
7%
Room Temperature
7%
Oil Exploration
7%
Hardenability
6%
Packaging Material
6%
Physical Vapor Deposition
6%
